Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said that it plans to invest more than NT$1.86 trillion (US$60.5 billion) on an advanced factory in Tainan to expand 3-nanometer chip capacity, after its plans to produce chips in the US triggered concerns at home over technology outflow and talent drain.
The world’s biggest contract chipmaker in 2018 said that it plans to spend NT$700 billion on a “giga-fab” in Tainan, dubbed Fab 18, to produce 5-nanometer chips, and establish a research and development (R&D) team. The company at the time said that it would reserve half of the facility’s space for the production of 3-nanometer chips.
